Flangeless Terminations

HYBR-FILM ™ Flangeless Terminations are high-performance RF and microwave power film termination products designed for solder attachment directly to a plated heat sink or plated-through-hole printed circuit board.

Standard power ratings range from 30 to 1,000 watts. Industry-standard configurations offer flexible design integration, while extensive testing and field experience demonstrate long-term performance and reliability.

Applications include Medical, Broadcast, Industrial, Commercial Wireless, Military, and Space.

P3 maintains an extensive HYBR-FILM design library, allowing modifications of standard products to meet specific application requirements. Contact the factory for special configurations or frequency ranges. These products are manufactured in the USA.

Standard Environmental Conditions

Operating Temperature: -55 to +150°C

Storage Temperature: -65 to +200°C

Humidity: 95% relative humidity, non-condensing

Vibration: 7 g's rms, 50-5000 CPS per MIL-STD-810B, Method 514, Procedure 5

Features

Easy System/Module Integration
Designed To Meet MIL-E-5400, MIL-P-23971
Wide Band Operation
Excellent High Power Capability

Series Selection Chart

Browse technical specifications and datasheets for our Flangeless Terminations.

Part Number	Power(Watts)	Freq.(GHz)	VSWR 1(Max GHz)	VSWR 2(Max GHz)	Value Ω(± 5%)	Chip Size(Inches)
T30-50	30	DC - 6.0	1.20 @ 1.0	1.50 @ 6.0	50	.100 x .200 x .040
TC30-50	30	DC - 4.0	1.20 @ 3.0	1.30 @ 4.0	50	.100 x .200 x .040
TP100-50	100	DC - 5.0	1.15 @ 4.0	1.25 @ 5.0	50	.250 x .250 x .060
TS125-50	125	DC - 5.0	1.25 @ 1.0	1.35 @ 5.0	50	.225 x .350 x .060
TG150-50	150	DC - 3.0	1.25 @ 2.0	1.30 @ 3.0	50	.375 x .250 x .040
TB200-50	200	DC - 2.0	1.20 @ 1.0	1.30 @ 2.0	50	.225 x .350 x .040
TM300-50	300	DC - 3.0	1.25 @ 2.0	1.30 @ 3.0	50	.375 x .375 x .060
TD400-50	400	DC - 1.5	1.20 @ 1.0	1.25 @ 1.5	50	.500 x .500 x .060
T1000-50	1000	DC - 1.0	1.06 @ 0.8	1.22 @ 1.0	50	1.00 x 1.040 x .060