CVD Diamond Chips
DIA-FILM™ attenuators, resistors, and terminations are manufactured using Chemical Vapor Deposition (CVD) diamond substrates, providing exceptional thermal conductivity for high-power RF and microwave applications.
Available in industry-standard sizes including 0402, 0505, 0603, 1310, and 2010, these components can dissipate up to 200 watts CW with appropriate heat sinking. CVD diamond has a low dielectric constant, making it suitable for high-frequency component and system designs.
The thin-film construction incorporates self-passivating Tantalum/Nitride resistor material with Titanium/Tungsten, Palladium, Nickel, and Gold films to provide highly reliable components.
Products are available mounted on gold-plated copper flanges for bolt-down assembly or with gold-plated copper tabs for soldering into stripline and microstrip circuits.
A sufficient heat sink is required to achieve maximum thermal performance. Standard products are designed to meet MIL-PRF-55342 and are RoHS compliant.
Packaging and Availability
Packaging options include Gel-Pak, waffle packs, tape and reel, vacuum-formed trays, and anti-static hinged boxes with foam. Contact P3 for special requirements or packaging.


